Cooling a device with no fan
Apple · Thermal design
2024
Designed the heat path for a fanless device so the processor could hold full speed for longer without the case becoming uncomfortable to touch.
Approach
• Mapped the hot spot with simulation, then confirmed it with thermocouples on early builds • Added a graphite spreader and a vapour-chamber path to the housing • Moved two components to open a conduction path to the largest metal surface
Result
Peak skin temperature down 4 °C at the same workload; sustained performance up 12%.
Details are described at the level of public product information. (In this fictional example, everything is invented.)